Publication Date:November 21, 1994 Availability:Usually ships in 1-2 business days
Editorial Reviews:
Product Description Deals with failure mechanisms that can occur in the manufacture and use of integrated circuit devices arising from improper choice of materials, oversights in engineering design, manufacturing or operating induced stresses such as mechanical cycling, heat, shock, vibration or corrosive environments. Covers gaps left in the literature regarding proper failure models and associated qualification standards.
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